Leddige, M.: search on Z-Library

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1

High-Speed Flex-Circuit Chip-to-Chip Interconnects

Braunisch, H., Jaussi, J.E., Mix, J.A., Trobough, M.B., Horine, B.D., Prokofiev, V., Daoqiang Lu,, Baskaran, R., Meier, P.C.H., Dong-Ho Han,, Mallory, K.E., Leddige, M.W.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1018 KB

english, 2008

2

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Flex-Circuit Chip-to-Chip Interconnects

Braunisch, H., Jaussi, J.E., Mix, J.A., Trobough, M.B., Horine, B.D., Prokofiev, V., Daoqiang Lu,, Baskaran, R., Meier, P.C.H., Dong-Ho Han,, Mallory, K.E., Leddige, M.W.

Year:

2006

Language:

english

File:

PDF, 656 KB

english, 2006

3

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Predictive correlation of resonance and radiation peaks in interconnect serpentine structure

Moua, X.K., Yun Ji,, Mallory, K., Leddige, M.

Year:

2002

Language:

english

File:

PDF, 306 KB

english, 2002

4

A 2.6-GByte/s multipurpose chip-to-chip interface

Lau, B., Yiu-Fai Chan, Moncayo, A., Ho, J., Allen, M., Salmon, J., Liu, J., Muthal, M., Lee, C., Nguyen, T., Horine, B., Leddige, M., Kuojim Huang, Wei, J., Leung Yu, Tarver, R., Yuwen Hsia, Vu, R., T

Journal:

IEEE Journal of Solid-State Circuits

Year:

1998

Language:

english

File:

PDF, 268 KB

english, 1998

5

A Crosstalk Friendly Signaling Method

Sreerama, Chaitanya, Hall, Stephen H., Huray, Paul G., Ramirez, Antonio Zenteno, Leddige, Mike, Oluwafemi, Femi, Aziz, Azniza Abd, Wight, Jeff

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 2.12 MB

english, 2018

6

Boomerang: Reducing Power Consumption of Response Packets in NoCs with Minimal Performance Impact

Zhen Fang, Hallnor, E.G., Bin Li, Leddige, M., Donglai Dai, Seung Eun Lee, Makineni, S., Iyer, R.

Journal:

IEEE Computer Architecture Letters

Year:

2010

Language:

english

File:

PDF, 343 KB

english, 2010

7

[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Multi-Gbit I/O and interconnect co-design for power efficient links

Jaussi, James E., Leddige, Mike, Horine, Bryce, O'Mahony, Frank, Casper, Bryan

Year:

2010

Language:

english

File:

PDF, 1.16 MB

english, 2010

8

INVESTIGATION OF B-MESON DECAYS INTO BARYONS WITH THE BABAR DETECTOR

LEDDIG, TORSTEN

Journal:

International Journal of Modern Physics A

Year:

2011

Language:

english

File:

PDF, 279 KB

english, 2011

9

CoQoS: Coordinating QoS-aware shared resources in NoC-based SoCs

Bin Li, Li Zhao, Ravi Iyer, Li-Shiuan Peh, Michael Leddige, Michael Espig, Seung Eun Lee, Donald Newell

Journal:

Journal of Parallel and Distributed Computing

Year:

2011

Language:

english

File:

PDF, 1.11 MB

english, 2011

10

[IEEE IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, CA, USA (25-27 Oct. 1999)] IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) - Physical layer design of a 1.6 GB/s DRAM bus

Moncayo, A., Hindi, S., Ching-Chao Huang,, Kollipara, R., Haw-Jyh Liaw,, Nguyen, D., Perino, D., Sarfaraz, A., Yuan, C., Leddige, M., McCall, J., Xang Moua,, Salmon, J.

Year:

1999

Language:

english

File:

PDF, 365 KB

english, 1999

11

Bdecays to baryons

Journal:

Year:

2012

Language:

english

File:

PDF, 2.74 MB

english, 2012

12

[IEEE 1998 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC - San Francisco, CA, USA (5-7 Feb. 1998)] 1998 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, ISSCC. First Edition (Cat. No.98CH36156) - A 2.6 GB/s multi-purpose chip-to-chip interface

Lau, B., Chan, Y.-F., Moncayo, A., Ho, J., Allen, M., Salmon, J., Liu, J., Muthal, M., Lee, C., Nguyen, T., Horine, B., Leddige, M., Huang, K., Wei, J., Yu, L., Tarver, R., Hsia, Y., Vu, R., Tsern, E.

Year:

1998

Language:

english

File:

PDF, 1.15 MB

english, 1998

13

A 4–32 Gb/s Bidirectional Link With 3-Tap FFE/6-Tap DFE and Collaborative CDR in 22 nm CMOS

Musah, Tawfiq, Jaussi, James, Balamurugan, Ganesh, Hyvonen, Sami, Hsueh, Tzu-Chien, Keskin, Gokce, Shekhar, Sudip, Kennedy, Joseph, Sen, Shreyas, Inti, Rajesh, Mansuri, Mozhgan, Leddige, Michael, Hori

Journal:

IEEE Journal of Solid-State Circuits

Year:

2014

Language:

english

File:

PDF, 2.73 MB

english, 2014

14

[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - 26.2 A 205mW 32Gb/s 3-Tap FFE/6-tap DFE bidirectional serial link in 22nm CMOS

Jaussi, James, Balamurugan, Ganesh, Hyvonen, Sami, Hsueh, Tzu-Chien, Musah, Tawfiq, Keskin, Gokce, Shekhar, Sudip, Kennedy, Joseph, Sen, Shreyas, Inti, Rajesh, Mansuri, Mozhgan, Leddige, Michael, Hori

Year:

2014

Language:

english

File:

PDF, 2.01 MB

english, 2014

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